By Duixian Liu; et al
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Extra resources for Advanced millimeter-wave technologies : antennas, packaging and circuits
The cavity-backed antenna decouples the design from the physical properties of the package such as dimensions and mold materials. The antenna performance shows an extremely low sensitivity to the cavity manufacturing tolerances and uncertainties of the mold material dielectric properties, being a key factor enabling the use of the presented low-cost packaging technology at mmWave frequencies.
Silicon IC surfaces are passivated and interconnect passives are less sensitive to encapsulation materials in contact with the IC surface. as silicon monolithic millimeter-wave integrated circuits (SIMMWICs) . Unlike these, silicon ICs may also use the metal stack of the so-called back-end-of-the-line (BEOL) for interconnects. In this case, the dielectric material is silicon dioxide (SiO2 ) as opposed to the silicon substrate material. The silicon IC interconnects are therefore confined in a vertical space that is an order of magnitude thinner (10 µm) than in MMIC technologies.
A MCM packaging technology additionally encapsulates the entire system hermetically. The attraction of a MCM technology, especially for large and complex systems, arises from increasing specialization of semiconductor devices. A system often consists of a larger number of chips, each optimized for a specific task. This makes it desirable to assemble many chips in a single package to reduce system size and external connections. A very high internal pin-count can be implemented inside a MCM, while the MCM package itself has a significantly reduced external pin-count.
Advanced millimeter-wave technologies : antennas, packaging and circuits by Duixian Liu; et al